(Image source from: Appleinsider.com)

The iPhone 17 series is said to be in the works, serving as the next iteration following the iPhone 16 lineup. Recent months have seen speculation that one notable addition to these anticipated devices could be a feature for thermal management—liquid cooling. This particular capability is absent from the iPhone 16 line and is expected to help prevent overheating during intense usage. While there have been mixed reports regarding whether this technology will be included in the iPhone 17 lineup, a new source indicates that it may be exclusive to the iPhone 17 Pro and iPhone 17 Pro Max models.

According to information shared by the tipster Instant Digital on the Chinese social media platform Weibo, both the iPhone 17 Pro and iPhone 17 Pro Max might utilize a “steam cavity” system for efficient heat dissipation. This suggests the incorporation of a vapour chamber, aligning with the concept of liquid cooling. The tipster added that these flagship devices are expected to use this technology to enhance the thermal handling of the new A19 Pro chipset that will power them, which is predicted to improve performance under heavy usage.

Currently, Apple's top models—the iPhone 16 Pro and iPhone 16 Pro Max—feature a graphene sheet designed for heat control and to mitigate the risk of overheating. This information aligns with previous assertions made by various insiders, initially hinted by TF International Security Analyst Ming-Chi Kuo last year, who noted that the vapour chamber technology would be restricted to the iPhone 17 Pro Max. However, a subsequent report from MyDrivers, a Chinese news outlet, contradicted Kuo's assertion, claiming that liquid cooling technology would actually be available across all models in the iPhone 17 series.

It is important to remember that there are still several months before the launch of the iPhone 17 series, so these rumors should be approached with caution. Additional information regarding these devices is anticipated to emerge as their release date approaches.