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According to analyst Ming-Chi Kuo of TF Securities International, Apple could integrate its own Wi-Fi and Bluetooth chips into the iPhone 17 series. The company is working on developing smartphone components to reduce dependence on existing suppliers such as Broadcom. Meanwhile, it has been suggested that Apple also plans to integrate its Wi-Fi and Bluetooth chips into more products starting in the second half of 2025, as well as the 5G chip expected to be introduced in the iPhone SE 4. (formerly Twitter) Kuo said Apple wants to quickly reduce its reliance on Broadcom for the more than 300 million chips that enable Wi-Fi and Bluetooth connectivity in its devices. To achieve this, analysts say the company will use its own chips in future products starting with the iPhone 17 series.

Apple's internal Wi-Fi and Bluetooth chips are based on TSMC's N7 (7nm) process and support the latest Wi-Fi 7 communications protocol, Kuo claims. The iPhone 17 series, the successor to the iPhone 16 series introduced in September, is said to be the first phone to use Apple's chips, but the company also plans to introduce new devices with its own chips. This isn't the only internal chip Apple will release in 2025. The company is reportedly planning to launch the fourth-generation iPhone SE with Apple's 5G modem, which Ko says will include a Broadcom chip for Wi-Fi. Wi-Fi and Bluetooth connection. Apple is expected to unveil new devices in the second half of 2025, including the rumored iPhone 17 series. These devices have new integrated Wi-Fi and Bluetooth chips, but no new 5G modems.

The analyst also noted that Apple's Wi-Fi and Bluetooth chips, as well as future 5G chips, are separate and manufactured using different TSMC processes, which could potentially overlap with chip integration plans. Kuo claims that Apple plans to build its own chips into almost all of its products over the next three years.